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Rigid PCB capability
Layer number, material, copper thickness, minimum finish thickness, maximum splice size, minimum aperture, etc
Learn more >>
Flexible Plate Processing Ability
Layer number, base material, thickness of gold core material, thickness of covering film, copper thickness of base material, etc
Learn more >>
IC substrate capability
Minimum plate thickness, minimum through-hole welding PAD, minimum blind-hole welding PAD, minimum line width and line spacing, etc
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SMT capability
Processing capability, component size, maximum component height, component packaging type, mounting capability, etc
Learn more >>
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